e/Shrink Small-Outline Package

Information
has gloss	eng: Shrink small-outline package (SSOP) is a microchip package for surface-mount technology. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).
lexicalization	eng: Shrink small-outline package
instance of	c/Chip carriers

Meaning
Portuguese
has gloss	por: Shrink Small-Outline Package (SSOP) é um encapsulamento de circuitos integrados para montagem superficial. Chips SSOP possuem terminais em formato de "asa de gaivota" emergindo dos dois lados longos, e um espaçamento entre terminais de 0,635 mm.
lexicalization	por: Shrink Small-Outline Package