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has gloss | eng: Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. Heating may be accomplished by passing the assembly through a reflow oven or under an infrared lamp or by soldering individual joints with a hot air pencil. |
lexicalization | eng: Reflow Soldering |
instance of | e/Electronic component |
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German | |
has gloss | deu: Der Begriff Reflow-Löten oder Wiederaufschmelzlöten (engl.: reflow soldering) bezeichnet ein in der Elektrotechnik gängiges Weichlötverfahren zum Löten von SMD-Bauteilen. Bei der Herstellung von Dickschicht-Hybridschaltungen ist es das häufigste Lötverfahren. |
lexicalization | deu: Reflow-Löten |
Japanese | |
lexicalization | jpn: リフロー |
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media:img | Process Window Index (bullseye).svg |
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