| lexicalization | eng: Chip carriers |
| subclass of | e/Electronic component |
| has instance | e/BGA1 |
| has instance | e/BGA2 |
| has instance | e/Cerquad |
| has instance | e/Chip scale package |
| has instance | e/Copper-tungsten |
| has instance | e/DO-204 |
| has instance | e/DO-41 |
| has instance | e/Die attachment |
| has instance | e/Electronic packaging |
| has instance | e/Flatpack (electronics) |
| has instance | e/HVQFN |
| has instance | e/Integrated circuit encapsulation |
| has instance | e/List of chip carriers |
| has instance | e/Low-profile Quad Flat Package |
| has instance | e/Micro Leadframe Package |
| has instance | e/MicroLeadFrame |
| has instance | e/Mini-Cartridge |
| has instance | e/Multi-leaded power package |
| has instance | e/PQFP |
| has instance | e/Package on package |
| has instance | e/QFN |
| has instance | e/Quadruple in-line package |
| has instance | e/Shrink Small-Outline Package |
| has instance | e/Single in-line package |
| has instance | e/Small-outline integrated circuit |
| has instance | e/TO-18 |
| has instance | e/TO220 |
| has instance | e/TO3 |
| has instance | e/TO92 |
| has instance | e/TSSOP |
| has instance | e/Thin Quad Flat Pack |
| has instance | e/Thin small-outline package |
| has instance | e/Wafer-level optics |
| has instance | e/Zig-zag in-line package |
| has instance | e/es/Encapsulado de un microprocesador |
| has instance | e/ru/Типы корпусов процессоров |
| has instance | e/zh/覆晶技術 |