e/Micro Leadframe Package

Information
has gloss	eng: Micro Leadframe Package (MLP) is a family of integrated circuit QFN packages, used in surface mounted electronic circuits designs. It is available in 3 versions which are MLPQ (Q stands for Quad), MLPM (M stands for Micro) and MLPD (D stands for Dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to Chip Scale Packages (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for Small-outline integrated circuit (SOIC) packages.
lexicalization	eng: Micro Leadframe Package
instance of	c/Chip carriers

Meaning
Portuguese
has gloss	por: Micro Leadframe Package (MLP) é uma família de circuitos integrados de encapsulamento QFN, usado em montagem superficial de circuitos eletrônicos. Está disponível em três versões, a MLPQ (Q de Quad), MLPM (M de Micro) e MLPD (Dual). Estes encapsulamentos geralmente possuem o conector do die exposto para melhorar a performance térmica. O MLPD foi projetado para ser compatível e susbtituir os encapsulamentos SOIC.
lexicalization	por: Micro Leadframe Package

Media
media:img	28 pin MLP integrated circuit.jpg