| has gloss | eng: The Multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifier. It was derived from single in-line package. The difference is the lead arrangement, multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of Multi-leaded power packages are simply stretched TO-220 package. Components made in Multi-leaded power packages can handle more power than those constructed in TO220 cases, or even TO3 cases with thermal resistance no less than 1.5 C/W. |
