e/Package on package

Information
has gloss	eng: Package on Package (PoP) is an integrated circuit packaging technique to allow vertically combining discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed on top of one another, i.e. stacked, with a standard interface to route signals between them. This allows higher density, for example in the mobile telephone / PDA market.
lexicalization	eng: Package on package
instance of	c/Chip carriers

Media
media:img	ASIC + Memory PoP Schematic.JPG