e/Zig-zag in-line package

Information
has gloss	eng: The zig-zag in-line package or ZIP was a short-lived packaging technology for integrated circuits, particularly dynamic RAM chips. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic, measuring about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages (TSOPs) used on single-in-line memory modules (SIMMs) and dual-in-line memory modules (DIMMs).
lexicalization	eng: Zig-zag in-line package
instance of	c/Chip carriers

Meaning
Catalan
has gloss	cat: Zig-zag in-line package va ser una tecnologia de curta vida per circuits integrats, particularment per a xips de memòries RAM dinàmiques. S'esperava que reemplacessin els Dual in-line package (DIP), però no va ser així.
lexicalization	cat: Zig-zag in-line package
Portuguese
has gloss	por: O zig-zag in-line package ou ZIP foi uma tecnologia de encapsulamento de circuitos integrados (particularmente chips DRAM) que não chegou a se firmar como padrão de mercado. Foi pensada como uma substituta do padrão DIP (ou DIL).
lexicalization	por: Zig-zag in-line package
Castilian
has gloss	spa: Zig-zag in-line package fue una tecnología de corta vida para circuitos integrados, particularmente para chips de memorias RAM dinámicas. Se esperaba que reemplazase a los Dual in-line package (DIP).
lexicalization	spa: Zig zag in line package
lexicalization	spa: Zig-zag in-line package

Media
media:img	Ic-package-ZIP.svg