| Information | |
|---|---|
| instance of | c/Chip carriers |
| Meaning | |
|---|---|
| Castilian | |
| has gloss | spa: Encapsulados más importantes: *DIP (Dual in-line package). *PGA (Pin grid array). *QFP (Quad Flat Package). *LQFP (Low-profile Quad Flat Package). *PLCC (Plastic Leaded Chip Carrier). |
| lexicalization | spa: Encapsulado de un microprocesador |
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